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Printed electronics

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As the top in Gravure Plate Making industry, Handoo package is leading printed electronics market.
Printed electronics
Printed electronics is the new process under which electrical circuit, sensor, element and several electrical products are produced by using printing process. Printed electronics has been highlighted as a technology which can replace traditional exposure process that requires expensive material, complex processes and high-cost equipment for manufacturing simple circuit and electrical parts. without complex processes, printed electronics can make pattern for material in exact point. Therefore, the technology has been receiving increasing attention.
Comparison of printing process and conventional process.
Printing process
  • Pattern
    Printing
  • Curing
2 Step
Conventional Process
  • Depositlon/
    Lamination
  • PR
    Coating
  • Masking
    Exposure
  • Developing
  • Etching
  • Stripping
6 Step
Printed electronics process technology includes material technology (ink for printed electronics like conductive ink, insulated material, metal nano-ink, etc.), ink-jet printing for printing material, new printing process technology (µ-contact printing, imprinting) and several equipment technology. Therefore, it can lead generation of new industry via fusion technology, and bring comprehensive impact on several fields.
  • Electronics
    • - Printed circuits & PCB
    • - Printed RFID
    • - Flexible electronics
    • - Battery
    • - Fuel cell
    • - Stretchable electronics
  • Display
    • - Flat panel display
    • - PLED
    • - LCD
    • - Color filter
    • - Display backplane
    • -Flexible display
  • 3D mechanical & optical
    • - 3D assembly system
    • - Microfluidics
    • - ptical lenses array
    • - Optical lenses array
    • - Light waveguides
  • Life science & chemical
    • - Precise DNA dispensing
    • - Biosensor
    • - Proteomics
    • - Antibodies
    • - Pathogen detection
    • - Medcal develo
Field Detail field Applicable area and printing process
Display & Lighting LCD Color filter, spacer : Ink-jet, roll printing
TFT Backplance : Semiconductor layer, Gate S/D electrode, insulation layer printing
PDP Wire : Ink-jet printing
Electromagnetic waves : Screen printing for Ag electrical conductor film filter
OLED Organic Light-Emitting layer : Ink-jet and nozzle jet for OLED manufacturing (macromolecule method)
Transparent electrode layer : Ink-jet, slot die coating for conductive macromolecule
Electrical paper Frontplane : Ink-jet, roll printing for partition (Wetting) and liquid injection
TFT Backplane : Imprinting and ink-jet for active layer and insulation layer
Lighting OLED Organic Light-Emitting layer : Ink-jet and nozzle jet for OLED manufacturing (macromolecule method)
Smart Product RFID Antenna : Roll printing Etc. Roll to Roll for capacity and chip
Packaging Sensor : Ink-jet, Roll, Screen printing for sensor layer
Energy Solar Cell CIGS, Cdte, DssC absorption layer : Spray, screen
OPV active layer : Ink-jet, slot-die, roll type Si electrode layer: Screen printing, ink-jet, AD method
Battery Electrode layer: Slot-die for electrode layer
Others Touch Panel Wiring : Screen and roll printing for electrode wiring
Transparent electrode layer: Jetting and roll printing for replacing patterned ITO
FPCB Wiring : Roll printing for generating high-density wiring
(Source : Displaybank, ‘Technology and Market outlook for Printed Electronics (2011~2020)’ Report)
Printed Electronics technology is a technology designed to produce several electrical elements by using functional electrical ink material (with which graphic art printing is available) and printing process with the most competitive cost. It has been recognized as a process technology for producing electrical products suitable for the next generation’s mobile IT device. Currently, the technology is only available to produce component products. But, as several ink materials and ultra-fine printing process technology are being developed, the technology is expected to be applied in several areas. It is expected that the technology will become a core process replacing conventional semi-conductor manufacturing process. Especially, printing process technology can be combined with flexible electronics (designed to produce electronic element on flexible plastic board by developing functional ink material that can be used in low-temperature). Therefore, the combination of the processes is expected to realize Roll-to-Roll in near future.