We are providing the best quality product by maintaining high quality based on automatic boomerang plating process, a cutting-edge facility.
There are many difficult area in maintaining plating process. Nevertheless, Handoo Package maintains our facility via automatic measurement and analysis system. With company-owned laboratory, any potential problem in plating can be prevented while doing its utmost to improve product’s quality.
With such a quality management for plating, Handoo Package has been engaged in mass production of roll for printed electronics which requires precise work.
Copper plating process
- Electrolytic removal
- Nickel plating
- Copper plating
When metal material is left in atmosphere, layer of dirt is generated.
If the layer exist even small amount, defect and peel can be caused during plating. Therefore, removal of the layer is important. Electrolytic removal is the process.
Appropriate adhesion can not be made if copper plating is made on iron cyliner directly. Therefore, nickel plating is needed to play a role as an adhesion agent between iron and copper.
Handoo Package uses copper sulphate plating. The characteristic is as below
- 1. Perfect specular can be obtained
- 2. High-speed plating is available
- 3. Leveling is excellent
- 4. Harmful cyanide is not used.
Boomerang copper plating line
Chrome plating Process
- Chrome plating
Helio method does not require corrosion process (while laser method requires corrosion process). Part having residual of resist on developed cylinder is not corroded. And, part without resist is corroded by acid and forms cell
Resist exists on the surface of cylinder which completing corrosion process. Removal of resist to make surface of copper is resist peeling work.
Copper itself has weak endurance. Therefore, chrome is coated on the surface of copper in order to enhance endurance and to protect cell.
Boomerang chrome plating line